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sn74aup1g17 www.ti.com sces579i ? june 2004 ? revised march 2010 low-power single schmitt-trigger buffer check for samples: sn74aup1g17 1 features ? available in the texas instruments nanostar ? ? wide operating v cc range of 0.8 v to 3.6 v package ? optimized for 3.3-v operation ? low static-power consumption ? 3.6-v i/o tolerant to support mixed-mode (i cc = 0.9 m a max) signal operation ? low dynamic-power consumption ? t pd = 5.1 ns max at 3.3 v (c pd = 4.4 pf typ at 3.3 v) ? suitable for point-to-point applications ? low input capacitance (c i = 1.5 pf typ) ? latch-up performance exceeds 100 ma per ? low noise ? overshoot and undershoot jesd 78, class ii < 10% of v cc ? esd performance tested per jesd 22 ? i off supports partial-power-down mode ? 2000-v human-body model operation (a114-b, class ii) ? includes schmitt-trigger inputs ? 1000-v charged-device model (c101) n.c. ? no internal connection. dnu ? do not use see mechancial drawings for dimensions. description/ordering information the aup family is ti ' s premier solution to the industry ' s low-power needs in battery-powered portable applications. this family ensures a very low static- and dynamic-power consumption across the entire v cc range of 0.8 v to 3.6 v, resulting in increased battery life. this product also maintains excellent signal integrity (see figure 1 and figure 2 ). 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. production data information is current as of publication date. copyright ? 2004 ? 2010, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. 3 2 4 5 1 n.c. v cc y a gnd dbv package (top view) gnd a n.c. n.c. 6 5 4 2 3 y v cc 1 dry package (top view) 3 2 4 5 1 n.c. v cc y a gnd dck package (top view) 3 2 4 5 1 n.c. v cc y a gnd drl package (top view) gnd y 3 4 a 2 5 n.c. 6 1 n.c. v cc dsf package (top view) yzp package (top view) yfp package (top view) gnd dnu y v cc a 3 5 2 1 4 a1 b1c1 a2 c2 a v cc gnd 4 2 1 3 y a1 b1 a2 b2
sn74aup1g17 sces579i ? june 2004 ? revised march 2010 www.ti.com figure 1. aup ? the lowest-power family figure 2. excellent signal integrity this device functions as an independent gate with schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input. nanostar ? package technology is a major breakthrough in ic packaging concepts, using the die as the package. this device is fully specified for partial-power-down applications using i off . the i off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ordering information (1) orderable part top-side t a package (2) number marking (3) nanostar ? wcsp (dsbga) reel of 3000 sn74aup1g17yfpr _ _ _h7_ 0.23-mm large bump ? yfp (pb-free) nanostar ? wcsp (dsbga) reel of 3000 SN74AUP1G17YZPR _ _ _h7_ 0.23-mm large bump ? yzp (pb-free) qfn ? dry reel of 5000 sn74aup1g17dryr h7 uqfn ? dsf reel of 5000 sn74aup1g17dsfr h7 ? 40 c to 85 c reel of 3000 sn74aup1g17dbvr sot (sot-23) ? dbv h17_ reel of 250 sn74aup1g17dbvt reel of 3000 sn74aup1g17dckr sot (sc-70) ? dck h7_ reel of 250 sn74aup1g17dckt sot (sot-553) ? drl reel of 4000 sn74aup1g17drlr h7_ (1) for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti web site at www.ti.com . (2) package drawings, thermal data, and symbolization are available at www.ti.com/packaging . (3) dbv/dck/drl: the actual top-side marking has one additional character that designates the wafer fab/assembly site. yfp/yzp: the actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. pin 1 identifier indicates solder-bump composition (1 = snpb, ? = pb-free). function table input output a y h h l l 2 submit documentation feedback copyright ? 2004 ? 2010, texas instruments incorporated product folder link(s): sn74aup1g17 ?0.5 0 0.5 1 1.5 2 2.5 3 3.5 0 5 10 15 20 25 30 35 40 45 time ? ns v oltage ? v 2 aup1g08 data at c l = 15 pf switching characteristics at 25 mhz 2 output input aup lvc aup aup lvc static-power consumption ( m a) dynamic-power consumption (pf) 2 single, dual, and triple gates 3.3-v logic 2 3.3-v logic 2 0% 20% 40% 60% 80% 100% 0% 20% 40% 60% 80% 100%
sn74aup1g17 www.ti.com sces579i ? june 2004 ? revised march 2010 logic diagram (positive logic) (dbv, dck, drl, drt, dry, and yzp packages) logic diagram (positive logic) (yfp package) copyright ? 2004 ? 2010, texas instruments incorporated submit documentation feedback 3 product folder link(s): sn74aup1g17 a y 2 4 a y 1 3
sn74aup1g17 sces579i ? june 2004 ? revised march 2010 www.ti.com absolute maximum ratings (1) over operating free-air temperature range (unless otherwise noted) min max unit v cc supply voltage range ? 0.5 4.6 v v i input voltage range (2) ? 0.5 4.6 v v o voltage range applied to any output in the high-impedance or power-off state (2) ? 0.5 4.6 v v o output voltage range in the high or low state (2) ? 0.5 v cc + 0.5 v i ik input clamp current v i < 0 ? 50 ma i ok output clamp current v o < 0 ? 50 ma i o continuous output current 20 ma continuous current through v cc or gnd 50 ma dbv package 206 dck package 252 drl package 142 q ja package thermal impedance (3) c/w dsf package 300 dry package 234 yfp/yzp package 132 t stg storage temperature range ? 65 150 c (1) stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operating conditions " is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) the input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. (3) the package thermal impedance is calculated in accordance with jesd 51-7. recommended operating conditions (1) min max unit v cc supply voltage 0.8 3.6 v v i input voltage 0 3.6 v v o output voltage 0 v cc v v cc = 0.8 v ? 20 m a v cc = 1.1 v ? 1.1 v cc = 1.4 v ? 1.7 i oh (2) high-level output current v cc = 1.65 ? 1.9 ma v cc = 2.3 v ? 3.1 v cc = 3 v ? 4 v cc = 0.8 v 20 m a v cc = 1.1 v 1.1 v cc = 1.4 v 1.7 i ol (2) low-level output current v cc = 1.65 v 1.9 ma v cc = 2.3 v 3.1 v cc = 3 v 4 t a operating free-air temperature ? 40 85 c (1) all unused inputs of the device must be held at v cc or gnd to ensure proper device operation. refer to the ti application report, implications of slow or floating cmos inputs, literature number scba004. (2) defined by the signal-integrity requirements and design-goal priorities 4 submit documentation feedback copyright ? 2004 ? 2010, texas instruments incorporated product folder link(s): sn74aup1g17
sn74aup1g17 www.ti.com sces579i ? june 2004 ? revised march 2010 electrical characteristics over operating free-air temperature range (unless otherwise noted) t a = 25 c t a = ? 40 c to 85 c parameter test conditions v cc unit min typ max min max 0.8 v 0.3 0.6 0.3 0.6 1.1 v 0.53 0.9 0.53 0.9 v t+ 1.4 v 0.74 1.11 0.74 1.11 positive-going v input threshold 1.65 v 0.91 1.29 0.91 1.29 voltage 2.3 v 1.37 1.77 1.37 1.77 3 v 1.88 2.29 1.88 2.29 0.8 v 0.1 0.6 0.1 0.6 1.1 v 0.26 0.65 0.26 0.65 v t ? 1.4 v 0.39 0.75 0.39 0.75 negative-going v input threshold 1.65 v 0.47 0.84 0.47 0.84 voltage 2.3 v 0.69 1.04 0.69 1.04 3 v 0.88 1.24 0.88 1.24 0.8 v 0.07 0.5 0.07 0.5 1.1 v 0.08 0.46 0.08 0.46 v t 1.4 v 0.18 0.56 0.18 0.56 hysteresis v 1.65 v 0.27 0.66 0.27 0.66 (v t+ ? v t ? ) 2.3 v 0.53 0.92 0.53 0.92 3 v 0.79 1.31 0.79 1.31 i oh = ? 20 m a 0.8 v to 3.6 v v cc ? 0.1 v cc ? 0.1 i oh = ? 1.1 ma 1.1 v 0.75 v cc 0.7 v cc i oh = ? 1.7 ma 1.4 v 1.11 1.03 i oh = ? 1.9 ma 1.65 v 1.32 1.3 v oh v i oh = ? 2.3 ma 2.05 1.97 2.3 v i oh = ? 3.1 ma 1.9 1.85 i oh = ? 2.7 ma 2.72 2.67 3 v i oh = ? 4 ma 2.6 2.55 i ol = 20 m a 0.8 v to 3.6 v 0.1 0.1 0.3 0.3 i ol = 1.1 ma 1.1 v v cc v cc i ol = 1.7 ma 1.4 v 0.31 0.37 i ol = 1.9 ma 1.65 v 0.31 0.35 v ol v i ol = 2.3 ma 0.31 0.33 2.3 v i ol = 3.1 ma 0.44 0.45 i ol = 2.7 ma 0.31 0.33 3 v i ol = 4 ma 0.44 0.45 i i a inputs v i = gnd to 3.6 v 0 v to 3.6 v 0.1 0.5 m a i off v i or v o = 0 v to 3.6 v 0 v 0.2 0.6 m a i off v i or v o = 0 v to 3.6 v 0 v to 0.2 v 0.2 0.6 m a v i = gnd or (v cc to 3.6 v), i cc 0.8 v to 3.6 v 0.5 0.9 m a i o = 0 i cc v i = v cc 0.6 v, i o = 0 3.3 v 40 50 m a 0 v 1.5 c i v i = v cc or gnd pf 3.6 v 1.5 c o v o = gnd 0 v 2.5 pf copyright ? 2004 ? 2010, texas instruments incorporated submit documentation feedback 5 product folder link(s): sn74aup1g17
sn74aup1g17 sces579i ? june 2004 ? revised march 2010 www.ti.com switching characteristics over recommended operating free-air temperature range, c l = 5 pf (unless otherwise noted) (see figure 3 and figure 4 ) t a = 25 c t a = ? 40 c to 85 c from to parameter v cc unit (input) (output) min typ max m in max 0.8 v 22.7 1.2 v 0.1 v 6.3 8 12.8 3.9 14.6 1.5 v 0.1 v 4.6 5.8 8.4 2.8 10 t pd a y ns 1.8 v 0.15 v 3.9 4.8 7.2 2.4 8.1 2.5 v 0.2 v 3.1 3.6 5.1 2 6.1 3.3 v 0.3 v 2.7 3 4.4 1.9 5.1 switching characteristics over recommended operating free-air temperature range, c l = 10 pf (unless otherwise noted) (see figure 3 and figure 4 ) t a = 25 c t a = ? 40 c to 85 c from to parameter v cc unit (input) (output) min typ max min max 0.8 v 25.1 1.2 v 0.1 v 7.1 9.1 13.8 4.7 15.6 1.5 v 0.1 v 5.2 6.5 9.4 3.4 11 t pd a y ns 1.8 v 0.15 v 4.5 5.4 8 2.9 9 2.5 v 0.2 v 3.5 4.2 5.7 2.4 6.8 3.3 v 0.3 v 3.1 3.5 4.9 2.2 5.7 switching characteristics over recommended operating free-air temperature range, c l = 15 pf (unless otherwise noted) (see figure 3 and figure 4 ) t a = 25 c t a = ? 40 c to 85 c from to parameter v cc unit (input) (output) min typ max min max 0.8 v 27.6 1.2 v 0.1 v 7.8 10.1 14.8 5.3 16.7 1.5 v 0.1 v 5.8 7.4 10.3 3.9 12 t pd a y ns 1.8 v 0.15 v 5 6.1 8.8 3.4 10 2.5 v 0.2 v 4 4.7 6.4 2.8 7.5 3.3 v 0.3 v 3.5 4.1 5.4 2.6 6.2 switching characteristics over recommended operating free-air temperature range, c l = 30 pf (unless otherwise noted) (see figure 3 and figure 4 ) t a = 25 c t a = ? 40 c to 85 c from to parameter v cc unit (input) (output) min typ max min max 0.8 v 35.1 1.2 v 0.1 v 10 13.1 18.1 7.5 19.8 1.5 v 0.1 v 7.4 9.6 12.9 5.6 14.9 t pd a y ns 1.8 v 0.15 v 6.4 7.9 11 4.8 12.4 2.5 v 0.2 v 5.2 6.1 7.9 4 9.3 3.3 v 0.3 v 4.6 5.3 6.7 3.6 7.7 6 submit documentation feedback copyright ? 2004 ? 2010, texas instruments incorporated product folder link(s): sn74aup1g17
sn74aup1g17 www.ti.com sces579i ? june 2004 ? revised march 2010 operating characteristics t a = 25 c parameter test conditions v cc typ unit 0.8 v 4 1.2 v 0.1 v 4 1.5 v 0.1 v 4 c pd power dissipation capacitance f = 10 mhz pf 1.8 v 0.15 v 4 2.5 v 0.2 v 4.2 3.3 v 0.3 v 4.4 copyright ? 2004 ? 2010, texas instruments incorporated submit documentation feedback 7 product folder link(s): sn74aup1g17
sn74aup1g17 sces579i ? june 2004 ? revised march 2010 www.ti.com parameter measurement information (propagation delays, setup and hold times, and pulse duration) figure 3. load circuit and voltage waveforms 8 submit documentation feedback copyright ? 2004 ? 2010, texas instruments incorporated product folder link(s): sn74aup1g17 v m from output under t est c l (see note a) load circuit 1 m volt age w aveforms propaga tion dela y times inverting and noninverting outputs t plh t phl t phl t plh v oh v oh v ol v ol v i 0 v input outputoutput notes: a. c l includes probe and jig capacitance. b. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z o = 50 , t r /t f = 3 ns. c. the outputs are measured one at a time, with one transition per measurement. d. t plh and t phl are the same as t pd . e. all parameters and waveforms are not applicable to all devices. v m v m v m v m v m 5, 10, 15, 30 pf v cc /2 v cc v cc = 1.2 v 0.1 v v cc = 0.8 v v cc = 1.5 v 0.1 v v cc = 1.8 v 0.15 v v cc = 2.5 v 0.2 v v cc = 3.3 v 0.3 v 5, 10, 15, 30 pf v cc /2 v cc 5, 10, 15, 30 pf v cc /2 v cc 5, 10, 15, 30 pf v cc /2 v cc c l v m v i 5, 10, 15, 30 pf v cc /2 v cc 5, 10, 15, 30 pf v cc /2 v cc t h t su data input t iming input v cc 0 vv cc 0 v 0 v t w input volt age w aveforms setup and hold times volt age w aveforms pulse dura tion v cc /2 v cc /2 v cc /2 v cc /2 v cc v cc /2
sn74aup1g17 www.ti.com sces579i ? june 2004 ? revised march 2010 parameter measurement information (enable and disable times) figure 4. load circuit and voltage waveforms copyright ? 2004 ? 2010, texas instruments incorporated submit documentation feedback 9 product folder link(s): sn74aup1g17 notes: a. c l includes probe and jig capacitance. b. w aveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control. waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. c. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z o = 50 , t r /t f = 3 ns. d. the outputs are measured one at a time, with one transition per measurement. e. t plz and t phz are the same as t dis . f. t pzl and t pzh are the same as t en . g. all parameters and waveforms are not applicable to all devices. 5, 10, 15, 30 pf v cc /2 v cc 0.15 v v cc = 1.2 v 0.1 v v cc = 0.8 v v cc = 1.5 v 0.1 v v cc = 1.8 v 0.15 v v cc = 2.5 v 0.2 v v cc = 3.3 v 0.3 v 5, 10, 15, 30 pf v cc /2 v cc 0.1 v 5, 10, 15, 30 pf v cc /2 v cc 0.1 v 5, 10, 15, 30 pf v cc /2 v cc 0.1 v c l v m v i v 5, 10, 15, 30 pf v cc /2 v cc 0.15 v 5, 10, 15, 30 pf v cc /2 v cc 0.3 v output w aveform 1 s1 at 2 v cc (see note b) output w aveform 2 s1 at gnd (see note b) v ol v oh t pzl t pzh t plz t phz v cc 0 v v ol + v v oh ? v 0 v v cc volt age w aveforms enable and disable times low - and high-level enabling output control v cc /2 v cc /2 v cc /2 v cc /2 t plz /t pzl t phz /t pzh 2 v cc gnd test s1 from output under t est c l (see note a) load circuit s1 gnd 5 k 5 k 2 v cc
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) sn74aup1g17dbvr active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17dbvre4 active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17dbvrg4 active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17dbvt active sot-23 dbv 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17dbvte4 active sot-23 dbv 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17dbvtg4 active sot-23 dbv 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17dckr active sc70 dck 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17dckre4 active sc70 dck 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17dckrg4 active sc70 dck 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17dckt active sc70 dck 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17dckte4 active sc70 dck 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17dcktg4 active sc70 dck 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17drlr active sot drl 5 4000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17drlrg4 active sot drl 5 4000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74aup1g17dryr active son dry 6 5000 green (rohs & no sb/br) nipdau level-1-260c-unlim sn74aup1g17dsfr active son dsf 6 5000 green (rohs & no sb/br) nipdau level-1-260c-unlim sn74aup1g17yfpr active dsbga yfp 4 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim SN74AUP1G17YZPR active dsbga yzp 5 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package option addendum www.ti.com 23-apr-2010 addendum-page 1
package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of sn74aup1g17 : ? enhanced product: sn74aup1g17-ep note: qualified version definitions: ? enhanced product - supports defense, aerospace and medical applications package option addendum www.ti.com 23-apr-2010 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74aup1g17dbvr sot-23 dbv 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 q3 sn74aup1g17dbvr sot-23 dbv 5 3000 180.0 9.2 3.23 3.17 1.37 4.0 8.0 q3 sn74aup1g17dbvt sot-23 dbv 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 q3 sn74aup1g17dbvt sot-23 dbv 5 250 180.0 9.2 3.23 3.17 1.37 4.0 8.0 q3 sn74aup1g17dckr sc70 dck 5 3000 180.0 9.2 2.24 2.34 1.22 4.0 8.0 q3 sn74aup1g17dckr sc70 dck 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 q3 sn74aup1g17dckt sc70 dck 5 250 180.0 9.2 2.24 2.34 1.22 4.0 8.0 q3 sn74aup1g17dckt sc70 dck 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 q3 sn74aup1g17drlr sot drl 5 4000 180.0 9.2 1.78 1.78 0.69 4.0 8.0 q3 sn74aup1g17dryr son dry 6 5000 180.0 8.4 1.25 1.6 0.7 4.0 8.0 q1 sn74aup1g17dsfr son dsf 6 5000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 q2 sn74aup1g17yfpr dsbga yfp 4 3000 178.0 9.2 0.89 0.89 0.58 4.0 8.0 q1 SN74AUP1G17YZPR dsbga yzp 5 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 q1 package materials information www.ti.com 20-jul-2010 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) sn74aup1g17dbvr sot-23 dbv 5 3000 180.0 180.0 18.0 sn74aup1g17dbvr sot-23 dbv 5 3000 205.0 200.0 33.0 sn74aup1g17dbvt sot-23 dbv 5 250 180.0 180.0 18.0 sn74aup1g17dbvt sot-23 dbv 5 250 205.0 200.0 33.0 sn74aup1g17dckr sc70 dck 5 3000 205.0 200.0 33.0 sn74aup1g17dckr sc70 dck 5 3000 180.0 180.0 18.0 sn74aup1g17dckt sc70 dck 5 250 205.0 200.0 33.0 sn74aup1g17dckt sc70 dck 5 250 180.0 180.0 18.0 sn74aup1g17drlr sot drl 5 4000 202.0 201.0 28.0 sn74aup1g17dryr son dry 6 5000 202.0 201.0 28.0 sn74aup1g17dsfr son dsf 6 5000 202.0 201.0 28.0 sn74aup1g17yfpr dsbga yfp 4 3000 220.0 220.0 35.0 SN74AUP1G17YZPR dsbga yzp 5 3000 220.0 220.0 34.0 package materials information www.ti.com 20-jul-2010 pack materials-page 2

x: max = y: max = 1430 m, min = 930 m, min = 1370 m870 m
x: max = y: max = 1430 m, min = 930 m, min = 1370 m870 m
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